Quote for Part XC3090-70PG175B by Xilinx Inc - NSN 5962-01-380-6218 Part
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Part Number: XC3090-70PG175B
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Alternate P/N: XC309070PG175B
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Manufacturer: Xilinx Inc
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NSN: 5962-01-380-6218 (5962013806218)
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NIIN: 013806218
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Item Name : Microcircuit Memory
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CAGE Code: 68994
Part number XC3090-70PG175B , Microcircuit Memory by Xilinx Inc with NSN 5962013806218 is now available in our ready-to-ship inventory. Are you interested in a quick quote for the part number XC3090-70PG175B? If so, just fill out the Request for Quote (RFQ) form above and click submit.
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NSN Information for Part Number XC3090-70PG175B with NSN 5962-01-380-6218, 5962013806218
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-380-6218 Item Description: Microcircuit Memory | 5962 | 013806218 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | G | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Xc3090-70pg175b | 1 | 1 | 5 |
Characteristics Data of NSN 5962-01-380-6218, 5962013806218
MRC | Criteria | Characteristic |
---|---|---|
CZER | Memory Device Type | PAL |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CQSJ | Inclosure Material | CERAMIC |
CBBL | Features Provided | BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMABLE |
PMLC | Precious Material And Location | TERMINALS GOLD |
CQZP | Input Circuit Pattern | 64 INPUT AND 10 INPUT |
CWSG | Terminal Surface Treatment | GOLD |
CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
PRMT | Precious Material | GOLD |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
TTQY | Terminal Type And Quantity | 175 FLAT LEADS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
MRC | Decoded Requirement | Clear Text Reply |
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