NSN 5962-01-334-6777, (5962013346777) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-01-334-6777 manufactured by General Dynamics Corporation, General Dynamics Information Systems, Integrated Device Technology Inc, Intersil Communications Inc, Intersil Corporation. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-01-334-6777 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than 14987200-19, 6116S70L B, HM4-65162B-8? Related NSN parts are listed below for your convenience.
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Alternative NSN: 5962013346777 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013346777 |
NCB Code: USA (01) |
Manufacturers: General Dynamics Corporation , General Dynamics Information Systems , Integrated Device Technology Inc , Intersil Communications Inc , Intersil Corporation |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
14987200-19 | general dynamics corporation | microcircuit memory | Avl | RFQ |
14987200-19 | general dynamics information systems | microcircuit memory | Avl | RFQ |
6116S70L B | integrated device technology inc | microcircuit memory | Avl | RFQ |
HM4-65162B-8 | intersil communications inc | microcircuit memory | Avl | RFQ |
HM4-65162B-8 | intersil corporation | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013346777
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.075 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND POSITIVE OUTPUTS |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4A MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
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