NSN 5962-01-287-0075, (5962012870075) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-01-287-0075 manufactured by Cypress Semiconductor Inc, Dla Land And Maritime, S C I Technology Inc. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-01-287-0075 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than CY7C291-35QMB, ROM PROM FAMILY 126, 5188890-001, 83C097-001? Related NSN parts are listed below for your convenience.
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| Alternative NSN: 5962012870075 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012870075 |
| NCB Code: USA (01) |
| Manufacturers: Cypress Semiconductor Inc , Dla Land And Maritime , S C I Technology Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| CY7C291-35QMB | cypress semiconductor inc | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 126 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5188890-001 | s c i technology inc | microcircuit memory | Avl | RFQ |
| 83C097-001 | s c i technology inc | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962012870075
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.458 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.114 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 413.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND HIGH SPEED AND PROGRAMMED AND ELECTROSTATIC SENSITIVE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM DELAY |
| CZER | MEMORY DEVICE TYPE | PROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
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