NSN 5962-01-257-8346, (5962012578346) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-01-257-8346 manufactured by Advanced Micro Devices Inc, Dla Land And Maritime, Honeywell Inc, Raytheon Company. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-01-257-8346 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than AM27S191A LMC, AM27S191A BUA, ROM PROM HEAD 108, 8505758-791, G104670-834? Related NSN parts are listed below for your convenience.
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Alternative NSN: 5962012578346 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012578346 |
NCB Code: USA (01) |
Manufacturers: Advanced Micro Devices Inc , Dla Land And Maritime , Honeywell Inc , Raytheon Company |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
AM27S191A LMC | advanced micro devices inc | microcircuit memory | Avl | RFQ |
AM27S191A BUA | advanced micro devices inc | microcircuit memory | Avl | RFQ |
ROM PROM HEAD 108 | dla land and maritime | microcircuit memory | Avl | RFQ |
8505758-791 | honeywell inc | microcircuit memory | Avl | RFQ |
G104670-834 | raytheon company | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962012578346
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.550 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.450 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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