NSN 5962-01-232-6519, (5962012326519) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-01-232-6519 manufactured by Advanced Micro Devices Inc, Dla Land And Maritime, Freescale Semiconductor Inc, Honeywell International Inc, Intel. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-01-232-6519 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than AM2716DMB, ROM PROM FAMILY 020, MCM2716BJXC, 10096520-T101, 10069392-101? Related NSN parts are listed below for your convenience.
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| Alternative NSN: 5962012326519 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012326519 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc , Dla Land And Maritime , Freescale Semiconductor Inc , Honeywell International Inc , Intel |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| AM2716DMB | advanced micro devices inc | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 020 | dla land and maritime | microcircuit memory | Avl | RFQ |
| MCM2716BJXC | freescale semiconductor inc | microcircuit memory | Avl | RFQ |
| 10096520-T101 | honeywell international inc | microcircuit memory | Avl | RFQ |
| 10069392-101 | honeywell international inc | microcircuit memory | Avl | RFQ |
| 10096520-101 | honeywell international inc | microcircuit memory | Avl | RFQ |
| MD2716 B | intel | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962012326519
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 525.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+100.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | ERR-060 NOMINAL HAND PULL AND ERR-060 NOMINAL HAND |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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