NSN 5962-01-157-9899, (5962011579899) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-01-157-9899 manufactured by Advanced Micro Devices Inc, Fairchild Semiconductor Ltd, Intersil Communications Inc, Intersil Corporation, Mmi Amd. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-01-157-9899 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than DH75703-605, HR10985, 93453 FMQB, B2052-605, 5353-1F 883B? Related NSN parts are listed below for your convenience.
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Alternative NSN: 5962011579899 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011579899 |
NCB Code: USA (01) |
Manufacturers: Advanced Micro Devices Inc , Fairchild Semiconductor Ltd , Intersil Communications Inc , Intersil Corporation , Mmi Amd , Raytheon Company |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
DH75703-605 | advanced micro devices inc | microcircuit memory | Avl | RFQ |
HR10985 | fairchild semiconductor ltd | microcircuit memory | Avl | RFQ |
93453 FMQB | fairchild semiconductor ltd | microcircuit memory | Avl | RFQ |
B2052-605 | intersil communications inc | microcircuit memory | Avl | RFQ |
B2052-605 | intersil corporation | microcircuit memory | Avl | RFQ |
5353-1F 883B | mmi amd | microcircuit memory | Avl | RFQ |
53S441F | mmi amd | microcircuit memory | Avl | RFQ |
19119 | mmi amd | microcircuit memory | Avl | RFQ |
932883-605 | raytheon company | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962011579899
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1085.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
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