NSN 5962-01-116-8853, (5962011168853) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-01-116-8853 manufactured by Dla Land And Maritime, Rockwell Collins Inc, Stmicroelectronics Ltd. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-01-116-8853 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than DMS 86067B, 647-2566-002, 351-8793-022, MKB36000J-84, MKB36940P-84? Related NSN parts are listed below for your convenience.
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| Alternative NSN: 5962011168853 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011168853 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Rockwell Collins Inc , Stmicroelectronics Ltd |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| DMS 86067B | dla land and maritime | microcircuit memory | Avl | RFQ |
| 647-2566-002 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| 351-8793-022 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| MKB36000J-84 | stmicroelectronics ltd | microcircuit memory | Avl | RFQ |
| MKB36940P-84 | stmicroelectronics ltd | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962011168853
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.150 INCHES MINIMUM AND 1.250 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 13499-351-8793 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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