NSN 5962-00-434-3075, (5962004343075) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-00-434-3075 manufactured by Dla Land And Maritime, Freescale Semiconductor Inc, Intersil Corporation, Raytheon Company. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-00-434-3075 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than ROM PROM FAMILY 001, SCM780FH21, HPR0M-0512, HPR0M9-0512-561BG0786, HPR0M9-0512? Related NSN parts are listed below for your convenience.
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| Alternative NSN: 5962004343075 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 004343075 |
| NCB Code: USA (00) |
| Manufacturers: Dla Land And Maritime , Freescale Semiconductor Inc , Intersil Corporation , Raytheon Company |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ROM PROM FAMILY 001 | dla land and maritime | microcircuit memory | Avl | RFQ |
| SCM780FH21 | freescale semiconductor inc | microcircuit memory | Avl | RFQ |
| HPR0M-0512 | intersil corporation | microcircuit memory | Avl | RFQ |
| HPR0M9-0512-561BG0786 | intersil corporation | microcircuit memory | Avl | RFQ |
| HPR0M9-0512 | intersil corporation | microcircuit memory | Avl | RFQ |
| HPR0M9-0512-121 | intersil corporation | microcircuit memory | Avl | RFQ |
| 932085-561B | raytheon company | microcircuit memory | Avl | RFQ |
| 932085-521B | raytheon company | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962004343075
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.375 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.375 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
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