NSN 5962-00-328-0131, (5962003280131) - Microcircuit Memory Parts List
Microcircuit Memory parts under NSN 5962-00-328-0131 manufactured by Intersil Communications Inc, Intersil Corporation, Raytheon Company. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5962-00-328-0131 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than HA2602-005, HA9-2602, B0406-005, 932458-501B? Related NSN parts are listed below for your convenience.
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| Alternative NSN: 5962003280131 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 003280131 |
| NCB Code: USA (00) |
| Manufacturers: Intersil Communications Inc , Intersil Corporation , Raytheon Company |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| HA2602-005 | intersil communications inc | microcircuit memory | Avl | RFQ |
| HA9-2602 | intersil corporation | microcircuit memory | Avl | RFQ |
| HA2602-005 | intersil corporation | microcircuit memory | Avl | RFQ |
| B0406-005 | intersil corporation | microcircuit memory | Avl | RFQ |
| 932458-501B | raytheon company | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962003280131
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND HIGH GAIN |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 22.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 10 FLAT LEADS |
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