NSN 5961-00-905-2155, (5961009052155) - Semiconductor Devic Parts List
Semiconductor Devic parts under NSN 5961-00-905-2155 manufactured by Boeing Company The, Dpa Labs Inc. All NSN items provided by NSN Parts Hub are compliant with fit, form, and functionality according to parameters set by the DLA. With over 3 billion new and obsolete parts in our searchable database, you can find your required part number of NSN 5961-00-905-2155 with ease when you use NSN Parts Hub as your purchasing partner. We maintain an unmatched supply-chain network with trusted MFRs and verified PMAs and are the only distributor with a No China Sourcing pledge. Do you require part numbers other than 479-0703-003, 89108796-01? Related NSN parts are listed below for your convenience.
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Alternative NSN: 5961009052155 |
Item Name: Semiconductor Devic |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 009052155 |
NCB Code: USA (00) |
Manufacturers: Boeing Company The , Dpa Labs Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
479-0703-003 | boeing company the | semiconductor devic | Avl | RFQ |
89108796-01 | dpa labs inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961009052155
MRC | Criteria | Characteristic |
---|---|---|
AGAV | III END ITEM IDENTIFICATION | LGM30 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CRTL | CRITICALITY CODE JUSTIFICATION | AGAV |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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